Scope of papers

Papers are requested on the following topics:

A - Quality and Reliability assessment techniques and methods for Devices and Systems

• Design for reliability, Built-in reliability,
• Virtual qualification, Reliability simulation,
• Advanced models for Reliability prediction,
• Reliability test structures, Limits to accelerated tests,
• Screening methods, Yield/reliability relationship,
• Obsolescence, Counterfeit.

B - Semiconductor Failure Mechanisms & Reliability for Si technologies & Nanoelectronics

• Process-related issues, Passivation stability,
• Hot carriers injection, NBTI, TDDB,
• High-K dielectrics and gate stacks,
• Low-K dielectrics and Cu interconnects,
• Metal migration: mechanical and thermal aspects,
• Non-volatile and programmable cells,
• Silicon on Insulator devices,
• Nano-electronics, Nano-electronic materials for solid state devices.

C - Progress in Failure Analysis: Defect Detection and Analysis

• Electron, ion and optical beam techniques,
• Scanning probe techniques,
• Static or dynamic techniques, Backside techniques,
• Acoustic microscopy,
• Electric or magnetic field based techniques,
• Electrical, thermal and thermo-mechanical characterization,
• Sample preparation, construction analysis,
• Failure analysis: case studies.

D - Reliability of Microwave devices and circuits

• Wide band gap semiconductors,
• Microwave and compound semiconductor devices,

E - Packaging and Assembly : Reliability and Failure Analysis

• Electrical Modeling & Simulations,
• Mechanical Modeling & Simulations,
• 3D / TSV, Flip chip, Advanced substrates,
• Chip/package interaction.

F - Power Devices and Microelectronic System: Reliability and Failure Analysis

• F1 - Smart-power devices, IGBT, thyristors,
• F2 - SiC and GaN power devices
• F3 - Power Electronic System

G - Photonics Reliability

• Solar Cells and Display,
• Optoelectronics,
• Organic electronics: OLED, Electronic Ink, TFT

H - MEMS and sensors Reliability

• Bio-electronics, Bio-sensors, Nano-Bio-technologies,
• MEMS and MOEMS,
• NEMS and nano-objects.

I - Extreme environments

• I1 - ESD and EMC (including EOS/Latchup on integrated circuits, EMC and EMI in integrated circuits and power electronic systems)
• I2 - Radiation (Radiation impact on circuits and systems reliability)